The electronics industry in Taiwan has achieved a complete information and communication\ntechnology chain with a firm position in the global electronics industry. The integrated-circuit (IC)\npackaging industry chain adopts a professional division of labor model, and each process (including\nwafer dicing, die bonding, wire bonding, molding, and other subsequent processes) must have\nenhanced process capabilities to ensure the quality of the final product. Increasing quality can also\nlower the chances of waste and rework, lengthen product lifespan, and reduce maintenance, which\nmeans fewer resources invested, less pollution and damage to the environment, and smaller social\nlosses. This contributes to the creation of a green process. This paper developed a complete quality\nevaluation model for the IC packaging molding process from the perspective of a green economy.\nThe Six Sigma quality index (SSQI), which can fully reflect process yield and quality levels, is selected\nas a primary evaluation tool in this study. Since this index contains unknown parameters, a confidence\ninterval based fuzzy evaluation model is proposed to increase estimation accuracy and overcome the\nissue of uncertainties in measurement data. Finally, a numerical example is given to illustrate the\napplicability and eectiveness of the proposed method.
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